ENTER
Specializing in global PCB sourcing and distribution, we deliver customized solutions, ISO-certified quality control, and rapid turnaround times, ensuring cost-effective and reliable supply chain partnerships.
|
Classification |
Details |
Classification |
Details |
|
Max Board Thickness |
6.5 mm |
Min clearance from hole to inner layer conductor |
0.18 mm |
|
Min Board Thickness |
0.1 mm |
Deviation between Different Layers |
0.035 mm |
|
Min Inner Layer Thickness |
0.035mm |
Pattern/Soldermask Thickness |
+/-0.035 mm |
|
Max Copper Thickness |
20 OZ |
Impedance Control |
+/-5% |
|
Min Copper Thickness |
1/4 OZ |
Working Panels |
1240 x 720 mm |
|
Max Number of Layers |
100 Layers |
Delivery Panels |
1210 x 690 mm |
|
Min Mechanical Drill Hole |
0.1 mm |
Distance (hole-to-hole) |
0.25 mm |
|
Drill Diameter Tolerance |
+/-0.02 mm |
Warpage and Twist |
0.35% |
|
Hole Position Tolerance |
+/-0.05 mm |
Below Are For HDI PCBs |
|
|
Board Thickness/Hole Diameter |
30:1 |
Min Laser Drill Hole |
0.05 mm |
|
Min L/S (Inner layer) |
0.025 mm |
Max Laser Drill Depth |
0.15 mm |
|
0.025 mm |
0.15 mm |
||
|
Min L/S (Outer layer) |
0.025 mm |
Max Laser Drill Depth |
0.03mm |
|
0.025 mm |
0.03mm |
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|
Conductor Width Tolerance |
+/-0.01 mm |
Layer Stucture |
Any layer |
|
Min Pad (Inner layer) |
Drill + 0.12 mm |
Pad's Diameter of Laser Drill |
Drill + 0.15 mm |
|
Min Pad (Outer layer) |
Drill + 0.12 mm |
Drill + 0.15 mm |
